Xiaomi, the popular Chinese smartphone manufacturer, is going to launch their new smartphone Xiaomi Civi 3 leaked to launch soon. The device is expected to pack several advanced features including the latest Dimension 8200 chipset and a 50-megapixel camera that promises to deliver exceptional image quality.
According to industry insiders, the Xiaomi Civi 3 leaked specifications includes to be a significant upgrade over its predecessor Xiaomi Civi 2, which was launched in September 2022. The new smartphone is expected to have a sleeker and more premium design with several improvements. Features that will set it apart from other mid-range smartphones in the market.
Highlights:
- The Xiaomi Civi 3 will be equipped with the MediaTek Dimensity 8200 chip, marking the first time that the Xiaomi Civi series will be using the MediaTek platform.
- The Dimensity 8200 chip uses TSMC’s new 4nm process and has a 1+3+4 architecture design. This advanced architecture is designed to provide maximum performance and energy efficiency.
- The Xiaomi Civi 3 will have a focus on selfies, with the phone featuring 2 front cameras and a screen shape similar to the Civi 2.
- The AnTuTu running score for the Dimensity 8200 is 900,000, indicating that the Xiaomi Civi 3 will be a powerful and fast phone.
Xiaomi Civi 3 leaked specifications
The Xiaomi Civi 3 will feature a Full HD+ resolution AMOLED panel display of 6.55 inch that supports a 120Hz refresh rate, according to tipster Digital Chat Station.
The Sony IMX800 primary camera is available on the back of the phone. The leak says that the Civi 3 has a 32-megapixel camera on the front.
Other rumours features of the Xiaomi Civi 3 include a high-refresh-rate display, 5G connectivity, the Xiaomi Civi 3 will have a battery capacity of 5,000 mAh and fast charging capabilities. The device is expected to run on the latest MIUI 14 UI, which is based on Android 13 OS.
Overall, With this combination of features, the Xiaomi Civi 3 is expected to be a strong contender for the title of “selfie king” in 2023.
Source ( 1 )