MediaTek and TSMC have announced a successful collaboration, achieving a significant milestone by developing MediaTek’s flagship Dimensity system-on-chip (SoC) using TSMC’s cutting-edge 3nm technology.
The partnership leverages MediaTek’s chip design expertise and TSMC’s manufacturing capabilities to create high-performance, energy-efficient SoCs for a wide range of global devices.
Joe Chen, MediaTek’s President, emphasized their commitment to using advanced technology to enhance our lives,crediting TSMC consistent manufacturing quality for enabling MediaTek to showcase its superior design in flagship chipsets.
Dr. Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC, highlighted the collaborative effort, stating that this partnership makes advanced semiconductor technology accessible to a broader audience.
TSMC’s 3nm process technology offers improved performance, power efficiency, and yield compared to its previous N5 process, boasting up to an 18% speed boost at the same power or a 32% power reduction at the same speed, along with approximately a 60% increase in logic density.
MediaTek’s Dimensity SoCs, built with leading-edge technology, cater to the growing demands of mobile computing, high-speed connectivity, AI, and multimedia.
Their first flagship chipset utilizing TSMC’s 3nm process is expected to power various devices, including smartphones, tablets, and intelligent cars, starting in the latter half of 2024.
Stay tuned with Craz Review.