MediaTek and Qualcomm are always position of rivalry. Previously MediaTek was badly introduced for overheating. For a long time of research and upgradation this company is in a better position than before.
MediaTek is continuously bringing the counterpart of Qualcomm. Like this MediaTek Dimensity 9300 SoC, which comes to compete with Snapdragon 8 Gen 3. It is the successor of the MediaTek Dimensity 9200 chipset. We have already seen Snapdragon 8 Gen 3 on Xiaomi 14.
MediaTek Dimensity 9300 SoC released
As the first device to equip the MediaTek Dimensity 9300 SoC vivo X100 series is willingly waiting for the launch in China. It is going to ensure the better performer chip that can ensure more speedy operation than before.
The Dimensity 9300 built on TSMC’s 3rd Generation 4nm+ process technology. While TSMC, Samsung Foundry and many more are going to the 3nm process which is still staying less than 75% yield rate. The prime Cortex-X4 cores pass 3.25GHz clock speed from four cores and another four cores of Cortex-A720 core of 2.0GHz speed.
This chip supports LPDDR5T RAM variant that has 9600 Mbps speed while Snapdragon 8 Gen 3 is still used LPDDR5X RAM and UFS 4.0 storage. It uses its own power efficiency features, by UltraSave 3.0+ technology. It is supported to run on Android 14 OS and Wi-Fi 7 features, up 6.5Gbps with Multi-Link Operation (MLO).
The display specs supported by Dimensity 9300 is a 180Hz refresh rate, WQHD+ resolution and dual display support for foldable devices. For Generative AI it uses MediaTek APU 790 silently.
Still it is known to us that MediaTek Dimensity 9300 is going to equip on vivo X100 and vivo X100 Pro, launching on November 13.